What youll be doing:
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units at NVIDIA (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units at NVIDIA (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.
Requirements:
What we need to see:
B.Sc. in Electronic Engineer degree or equivalent experience.
5+ years of experience in high-speed design.
Having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, DFM, DFA, DFT constraints in volume manufacturing is needed for this role.
Be an authority in using Cadence Allegro PCB design tools.
Have a deep understanding of High-Density Interconnect PCB layout and PCB Signal Integrity.
Knowledge in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling.
Proven ability to work with a team while taking personal responsibility for your own contributions.
Agility in changing focus as the needs of our effort evolve.
Strong leadership, communication, and presentation abilities.
What we need to see:
B.Sc. in Electronic Engineer degree or equivalent experience.
5+ years of experience in high-speed design.
Having a detailed knowledge of circuit design and consideration for layout, routing, and timing constraints, DFM, DFA, DFT constraints in volume manufacturing is needed for this role.
Be an authority in using Cadence Allegro PCB design tools.
Have a deep understanding of High-Density Interconnect PCB layout and PCB Signal Integrity.
Knowledge in PCB manufacturing processes for HDI, Standard Thru-Hole, and Back-drilling.
Proven ability to work with a team while taking personal responsibility for your own contributions.
Agility in changing focus as the needs of our effort evolve.
Strong leadership, communication, and presentation abilities.
Ways to stand out from the crowd:
Experience in crafting PCBs in the 25gbps + range using back-drilling technology.
Designing sophisticated multi-layer HDI PCB's for very dense placement and routing is helpful.
This position is open to all candidates.
