The ideal candidate is passionate about understanding how and why hardware fails at the physical level. You will develop and execute advanced physical failure analysis techniques to identify root causes in complex electronic and electro-optic assemblies. The role combines hands-on laboratory work, innovative sample preparation, materials characterization, and collaboration with multidisciplinary engineering teams to solve challenging hardware failures.
What you'll be doing:
Lead physical failure analysis investigations on advanced interconnect products, including PCBs, packages, optical modules, ASICs, and electro-mechanical assemblies.
Develop, optimize, and execute destructive and non-destructive sample preparation techniques to expose failure sites while preserving physical evidence.
Perform detailed failure analysis using advanced microscopy and analytical techniques, including: Scanning Electron Microscopy (SEM), Focused Ion Beam (FIB) cross-sectioning and circuit editing, Optical microscopy, X-ray imaging and CT, Cross-section analysis, Surface and fracture analysis
Correlate physical findings with electrical, optical, manufacturing, and reliability data to determine root cause.
Design new failure analysis methodologies and continuously improve laboratory capabilities, workflows, and best practices.
Partner with design, manufacturing, quality, reliability, packaging, and system engineering teams to drive corrective actions.
Generate clear technical reports documenting failure mechanisms, supporting evidence, and recommendations.
Evaluate and introduce new FA tools, sample preparation methods, and characterization techniques to improve investigation capability.
B.Sc., M.Sc., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related field.
3+ years of experience in hardware failure analysis, materials characterization, semiconductor analysis, or package analysis.
Hands-on experience with destructive sample preparation techniques including polishing, grinding, cross-sectioning, decapsulation, and precision material removal.
Strong experience operating analytical equipment such as: SEM, FIB, X-ray / CT, Optical microscopy
Strong understanding of hardware failure mechanisms in semiconductor devices, electronic packages, PCBs, solder joints, connectors, or optical assemblies.
Experience developing structured root cause investigations using physical evidence.
Excellent analytical, documentation, and communication skills.
Ability to independently drive complex investigations from initial failure through final root cause.
